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The latest Technology roadmaps and milestones shown by Intel give a rundown of their upcoming products from the Client and Server divisions. Intel states that they are on track to reclaim the perf per watt leadership by 2025 and have shown a range of products that will help them achieve this ambitious goal.
Intel Claims Sapphire Rapids-SP Supercharged HBM Xeon CPUs Over 2x Faster Than AMD EPYC Milan & Milan-X Chips
Intel remains on track to reclaim transistor performance per watt leadership by 2025. Intel’s advanced test and packaging technologies give it unmatched industry leadership that benefits its products and foundry customers and will play a critical part in the pursuit of Moore’s Law. Continuous innovation is the cornerstone of Moore’s Law, and innovation is very much alive and well at Intel.via Intel
Intel remains on track to reclaim transistor performance per watt leadership by 2025. Intel’s advanced test and packaging technologies give it unmatched industry leadership that benefits its products and foundry customers and will play a critical part in the pursuit of Moore’s Law. Continuous innovation is the cornerstone of Moore’s Law, and innovation is very much alive and well at Intel.
Intel Client CPU Roadmap
Starting with the Intel Client CPU roadmap, the company has already launched its Alder Lake CPU lineup, and its follow-up, the 13th Gen Raptor Lake lineup is on track for launch later this year. For Raptor Lake, 24 cores and 32 threads have been confirmed (8+16). The blue team is also promising up to double-digit performance gains, enhanced overclocking support, a new AI M.2 support, and socket compatibility with the Alder Lake platform (LGA 1700/1800).
CCG Roadmap Updates – Building upon its leadership products today, Intel’s roadmap for next-generation client products includes:
Intel Shares Key High NA EUV Machine Details & Capital Spending Plans
The next update to the Client CPU roadmap will come in the form of Meteor Lake which is scheduled for manufacturing on the ‘Intel 4’ process node in 2H 2022 and expected for launch in 2023. The ‘Intel 4’ node will deliver 20% performance per watt improvement and will be the first to use EUV technology, offering a significant increase in density over ‘Intel 7’ (10nm ESF). Intel will also be launching a follow-up to Meteor Lake in 2024 known as Arrow Lake.Ad
Both Meteor and Arrow Lake CPUs will feature several different core IPs composed of Intel 4 (Meteor Lake), Intel 20A (Arrow Lake), and TSMC’s N3 (Arc GPU / SOC) process node. What’s particularly interesting is that starting Meteor Lake, the new CPUs will feature a Tiled-GPU design featuring Arc graphics architecture. Raja Koduri states that this ‘tGPU’ will be unlike anything previously done on client CPUs and will be different than discrete and integrated graphics designs.
Moving beyond 2024, Intel plans to offer a major overhaul to its Client platform with Lunar Lake and Nova Lake chips. These will likely be scheduled for 2025 and 2026 releases, respectively. The next-generation CPUs will come within a tiled-CPU architecture, featuring an MCM CPU, SOC, and GPU IPs integrated on the same package. Both Lunar Lake & Nova Lake chips are expected to utilize the improved 18A node which will offer an additional 10% improvement in performance per watt and add more enhancements to the RibbonFET architecture. The manufacturing is scheduled for 1H 2024 for 20A and 2H 2024 for 18A chips. Other core IPs will be relying on external foundry nodes.
As you can see from the roadmap block diagrams, the next-gen Client platforms will be utilizing a fully-integrated MCM design, making use of several chiplets that will be integrated on the same CPU package. All in all, the following is the node-specific to the chiplet count we can expect on future client chips from team blue:
Intel Server CPU Roadmap
For servers, Intel plans to offer its first major architectural uplift in the form of Diamond Rapids which will be utilizing the ‘Intel 3’ process node. This node is expected to offer an 18% uplift in performance per watt and will utilize higher-performance libraries, optimized drive current, and metal stack. Intel states that it will have est wafers of their lead product (Xeon) running in their labs by the second half of 2022.
For the first time, Intel has also provided a first-look at its next-gen 18A powered Xeon CPU for the data center segment. This chip is shown with at least 17 tile blocks, 6 of which are CPU blocks.
The current Sapphire Rapids-SP Xeon CPUs feature 15 cores per CPU tile so an 18A chip with a similar core count will offer up to 90 cores though, by 2025, Intel would be offering more cores per CPU tile so we can definitely expect over 100 cores to match AMD’s high-core count offerings in the server segment. Diamond Rapids on the ‘3’ node is expected to offer up to 144 cores and 288 threads so 18A would definitely be offering a much higher core count. Intel has also confirmed that its Granite Rapid (P-Core) & Sierra Forest (E-Core) Xeon SKUs will be based on the ‘Intel 3’ process node.
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